Dongwu Electronics: OCP Summit Puts AI Interconnect in Focus, Highlights Domestic Switch Chips

Bullish

What Happened

The 2026 OCP Global Summit will be held October 12-15 in San Jose, with AI interconnect as the top theme, including open Scale-up Ethernet routes and multi-source protocols. Dongwu Electronics reiterates its positive view on the supernode industry trend and recommends domestic Ethernet switch chip maker Centec and server ODM Huaqin Technology.

Bottom Line

Dongwu Electronics is bullish on the AI interconnect and supernode supply chain, naming Centec and Huaqin Technology as key domestic beneficiaries ahead of the OCP Global Summit.

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