At the 4th Integrated Chips and Chiplets Conference, CXMT President Cao Kanyu announced that the company expects to launch a new-generation DDR5 RDIMM product by year-end, combining 4F² architecture with hybrid bonding technology.
CXMT's 4F² DDR5 launch signals a strategic 'de-EUV' path for China DRAM, with potential upside for domestic equipment and materials suppliers.
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