A semiconductor engineer cited by multiple media outlets said TSMC has tested silicon carbide and single-crystal diamond as backside heat-spreader materials for AI chips, and has preliminarily selected CVD single-crystal diamond, with plans to adopt it in high-end AI chips from 2H 2026. The broker note highlights this as a major signal for the diamond industry, marking a shift from industrial abrasive and lab-grown diamond labels to semiconductor-grade high-end material.
The broker is bullish on diamond heat dissipation, expecting large orders and recommending several Chinese diamond-related stocks.
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